2026-01-12 : 뉴스 9건, 기술자료 PDF 파일 55개입니다. 아래 링크 참고하시기 바랍니다. 다른 자료는 Search에서 키워드 입력하여 검색 가능합니다.
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| ♥ 반도체 뉴스 (9건) | ||||
| NO | 키워드 | 제목 | 등록일 | 출처 |
| N1 | 뉴스 모음 | 한국 반도체 산업협회 - 데일리 뉴스 모음 | 2026-01-12 6:30 | KSIA |
| https://www.ksia.or.kr/infomationKSIA.php?data_tab=1 | ||||
| N2 | 뉴스 모음 | [제20260108-TT-01호] 2026년 1월 8일 반도체 기술 관련 주요 뉴스 요약 | 2026-01-09 9:00 | SPTA Times |
| https://www.sptatimeskorea.com/post/제20260108-tt-01호-2026년-1월-8일-반도체-기술-관련-주요-뉴스-요약 | ||||
| N3 | 뉴스 모음 | [제20260108-TM-01호] 2026년 1월 8일 반도체 제조 관련 주요 뉴스 요약 | 2026-01-09 9:00 | SPTA Times |
| https://www.sptatimeskorea.com/post/제20260108-tm-01호-2026년-1월-8일-반도체-제조-관련-주요-뉴스-요약 | ||||
| N4 | 뉴스 모음 | [제20260108-TI-01호] 2026년 1월 8일 글로벌 반도체 산업 관련 주요 뉴스 요약 | 2026-01-09 9:00 | SPTA Times |
| https://www.sptatimeskorea.com/post/제20260108-ti-01호-2026년-1월-8일-글로벌-반도체-산업-관련-주요-뉴스-요약 | ||||
| N5 | 뉴스 모음 | [제20260109-TT-01호] 2026년 1월 9일 반도체 기술 관련 주요 뉴스 요약 | 2026-01-09 17:00 | SPTA Times |
| https://www.sptatimeskorea.com/post/제20260109-tt-01호-2026년-1월-9일-반도체-기술-관련-주요-뉴스-요약 | ||||
| N6 | 뉴스 모음 | [제20260109-TI-01호] 2026년 1월 9일 글로벌 반도체 산업 관련 주요 뉴스 요약 | 2026-01-09 17:00 | SPTA Times |
| https://www.sptatimeskorea.com/post/제20260109-ti-01호-2026년-1월-9일-글로벌-반도체-산업-관련-주요-뉴스-요약 | ||||
| N7 | 뉴스 모음 | [제 20260111-AI-01호] 2026년 1월 2주차 글로벌 반도체산업 관련 기사 분석 | 2026-01-11 2:00 | SPTA Times |
| https://www.sptatimeskorea.com/post/제-20260111-ai-01호-2026년-1월-2주차-글로벌-반도체산업-관련-기사-분석 | ||||
| N8 | 뉴스 모음 | Chip Industry Week in Review (영문) > hip sales record; chiplet ecosystem accelerator; CES blitz; SDV deals; global fabs; DRAM, NAND price spike; auto L4 delay; data center connectivity buy; GPU-driven swings in power demand; Intel’s 18A AI PC chip; glass substrate deal. |
2026-01-09 | Semiconductor Engineering |
| https://semiengineering.com/chip-industry-week-in-review-120/ | ||||
| N9 | 뉴스 모음 | 최신 동향 - AI·ICT Brief > [AI·ICT Brief 2026-01호] " > CES 2026, AI·ICT 10대 이슈 전망, 중국 인간형 AI 규제 Ⅰ 주요 이슈 1. CES 2026, 생성형 AI 붐을 지나 실질적 AI 도입 단계로 2. 2026년을 관통할 AI·ICT 10대 이슈 전망 Ⅱ 주요국 동향 1. 중국, 인간형 AI 규제 초안 발표 Ⅲ ICT 부문별 모니터링 Ⅳ 주요 ICT 행사 일정 |
2026-01-09 | ITFIND |
| https://www.itfind.or.kr/streamdocs/view/sd;streamdocsId=8TocIQMYInSrVhgLncE2nUMW6F4n7N070I00xV7usJ4 | ||||
| ♥ 반도체 기술 자료 (PDF 파일 55개) | ||||
| ※ Hot Chips 2025는 2025년8월24일~26일 미국 캘리포니아에서 개최된 세계적인 반도체 기술 컨퍼런스이다. > 엔비디아, 인텔, AMD, 구글, 애플, 삼성 등 글로벌 빅테크 기업들이 자사의 **최신 고성능 칩 (CPU, GPU, AI 가속기 등)**에 대한 세부 아키텍처를 처음으로 심도 있게 공개하는 자리이다. |
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| NO | 키워드 | 제목 | 등록일 | 출처 |
| T1 | AI, Datacenter |
Hot Chips 2025 > Tutorials: Sunday, August 24, 2025, Permalink : 7개 Time (PDT) Title Presenters 8:30AM-10:30AM Tutorial 1: Datacenter Racks . How AI workloads shape rack system architecture, Frank Helms, AMD . Scaling fabric technologies, Darrin Vallis, AMD . Liquid cooling with Google Characteristics, Jorge Padilla, Google . Rearchitected power systems, Harsha Bojja, Microsoft 10:55AM-12:25PM Tutorial 1: Datacenter Racks (cont) . Case study: Nvidia GB200NVL72, John Norton, NVIDIA . Case study: Meta’s Catalina (NVL72), William Arnold and Matt Bowman, Meta . Case study: Google TPU Rack, Pankaj Makhija, Google |
2025-08-24 | Hot Chips |
| https://hc2025.hotchips.org/ | ||||
| T2 | AI, GPU, TPU |
Hot Chips 2025 > Tutorials: Sunday, August 24, 2025, Permalink : 5개 Time (PDT) Title Presenters 1:30PM-3:30PM Tutorial 2: AI Kernel Programming . Introduction, Fredrik Kjolstad, Stanford . Decoupling Performance from Correctness with User-Schedulable Kernel Languages, Andrew Adams, Adobe Research . Pallas: Using JAX to write custom kernels for GPUs and TPUs, Sharad Vikram, Google 4:00PM-5:30PM Tutorial 2: Kernel Programming (cont) . Domain specific languages for GPU kernels and automatic kernel authoring with LLMs, Tri Dao, Princeton, Together AI . Programming techniques for implementing ML models on GPUs, Zihao Jia, CMU |
2025-08-24 | Hot Chips |
| https://hc2025.hotchips.org/ | ||||
| T3 | CPU, IBM, AI |
Hot Chips 2025 > Conference Day 1: Monday, August 25, 2025, Permalink : 5개 Time (PDT) Title Presenters 9:15AM-9:30AM Welcome . General Chair Welcome, Jan-Willem van de Waerdt & Larry Yang, General Chair . Program Co-Chairs Welcome, Ian Bratt & Nhon Quach, PC Co-Chairs 9:30AM-11:00AM CPU 1a, Chair: Gabriel Southern . Cuzco: A High-Performance RISC-V RVA23 Compatible CPU IP, Ty Garibay & Shashank Nemawarkar, Condor Computing . PEZY-SC4s: The Fourth Generation MIMD Many-core Processor with High Energy Efficiency and Fleibility for HPC and AI Applications, Naoya Hatta, PEZY Computing . IBM’s Next Generation Power Microprocessor, William Starke, IBM |
2025-08-25 | Hot Chips |
| https://hc2025.hotchips.org/ | ||||
| T4 | CPU, Intel |
Hot Chips 2025 > Conference Day 1: Monday, August 25, 2025, Permalink : 3개 Time (PDT) Title Presenters 11:30AM-12:00PM CPU 1b, Chair: Gabriel Southern . Introducing the Next Generation Intel® Xeon® Processor with Efficiency Cores, Don Soltis, Intel 12:00PM-1:00PM Security, Chair: Greg Papadopoulos . Presto: A RISC-V-Compatible SoC for Unified Multi-Scheme FHE Acceleration over Module Lattice, Luchang Lei & Hongyang Jia, Tsinghua University . Azure Secure Hardware Architecture: Establishing a Robust Security Foundation for Cloud Workloads, Bryan Kelly, Microsoft |
2025-08-25 | Hot Chips |
| https://hc2025.hotchips.org/ | ||||
| T5 | AI, AMD, SOC |
Hot Chips 2025 > Conference Day 1: Monday, August 25, 2025, Permalink : 4개 Time (PDT) Title Presenters 2:15PM-3:15PM Keynote #1, Chair: Cliff Young . Predictions for the Next Phase of AI, Noam Shazeer, GDM VP, Engineering, Google 3:15PM-4:45PM Graphics, Chair: Lavanya Subramanian . AMD RDNA 4 and Radeon RX 9000 Series GPU, Andy Pomianowski & Laks Pappu, AMD . RTX 5090: Designed for the Age of Neural Rendering, Marc Blackstein, NVIDIA . Specialized SoC enabling low-power ‘World Lock Rendering’ in Augmented and Mixed Reality Devices, Ohad Meitav & Jay Tsao, Meta |
2025-08-25 | Hot Chips |
| https://hc2025.hotchips.org/ | ||||
| T6 | AMD, NVIDIA, AI |
Hot Chips 2025 > Conference Day 1: Monday, August 25, 2025, Permalink : 4개 Time (PDT) Title Presenters 5:15PM-7:15PM Networking, Chair: Sherry Xu . Intel Mount Morgan Infrastructure Processing Unit (IPU), Patrick Fleming, Intel . AMD Pensando™ Pollara 400 AI NIC Architecture and Application, Kevin Chu, AMD . NVIDIA ConnectX-8 SuperNIC: A Programmable RoCE Architecture for AI Data Centers, Idan Burstein, NVIDIA . Tomahawk Ultra - Ultra Low Latency, High Bandwidth Ethernet Switch chip for HPC and AI/ML applications, Mohan Kalkunte & Asad Khamisy, Broadcom |
2025-08-25 | Hot Chips |
| https://hc2025.hotchips.org/ | ||||
| T7 | Photonic, Interposer |
Hot Chips 2025 > Conference Day 2: Tuesday, August 26, 2025, Permalink : 4개 Time (PDT) Title Presenters 8:30AM-10:30AM Optical, Chair: Borivoje Nikolic . Celestial AI Photonic Fabric Module (PF Module) - The world’s first SoC with in-die Optical IO, Phil Winterbottom, Celestial AI . A UCIe Optical I/O Retimer Chiplet for AI Scale-up Fabrics, Vladimir Stojanovic, Ayar Labs . Passage M1000: 3D photonic interposer for AI, Darius Bunandar, Lightmatter . Co-Packaged Silicon Photonics Switches for Gigawatt AI Factories, Gilad Shainer, NVIDIA |
2025-08-26 | Hot Chips |
| https://hc2025.hotchips.org/ | ||||
| T8 | AI, SOC |
Hot Chips 2025 > Conference Day 2: Tuesday, August 26, 2025, Permalink : 4개 Time (PDT) Title Presenters 11:00AM-12:30PM Power / Methodology, Chair: Jae W. Lee . ECAM Enabled Advanced Thermal Management Solutions for the AI Data Center, Michael Matthews, Fabric8Labs . Everactive Self-Powered SoC with Energy Harvesting, Wakeup Receiver, and Energy-Aware Subsystem, Ben Calhoun, Everactive . Taping Out Three Class Chips per Semester in Intel 16 Technology, Lucy Revina, UC Berkeley 1:40PM-1:45PM Awards . TCMM Awards Presentation, Gabriel Southern, TCMM Chair |
2025-08-26 | Hot Chips |
| https://hc2025.hotchips.org/ | ||||
| T9 | Rapidus, AI, Memory, Chiplet |
Hot Chips 2025 > Conference Day 2: Tuesday, August 26, 2025, Permalink : 4개 Time (PDT) Title Presenters 1:45PM-2:45PM Keynote #2, Chair: Yasuo Ishii . Up and Running with Rapidus: How Japan and Cutting-Edge Technologies are Transforming Semiconductor Manufacturing, Dr. Atsuyoshi Koike, Rapidus 2:45PM-4:15PM Machine Learning 1, Chair: Ronny Krashinsky . Memory: (Almost) the Only Thing That Matters, Mark Kuemerle, Marvell . Corsair - An In-memory Computing Chiplet Architecture for Inference-time Compute Acceleration, Sudeep Bhoja, d-Matrix . UB-Mesh: Huawei’s Next-Gen AI SuperComputer with A Unified-Bus Interconnect and nD-FullMesh Architecture, Liao Heng, Huawei |
2025-08-26 | Hot Chips |
| https://hc2025.hotchips.org/ | ||||
| T10 | NVIDIA, AMD |
Hot Chips 2025 > Conference Day 2: Tuesday, August 26, 2025, Permalink : 4개 Time (PDT) Title Presenters 4:45PM-6:15PM Machine Learning 2, Chair: Pradeep Dubey . NVIDIA’s GB10 SoC: AI Supercomputer On Your Desk, Andi Skende, NVIDIA . 4th Gen AMD CDNA™ Generative AI Architecture Powering AMD Instinct™ MI350 Series GPUs and Platforms, Michael Floyd & Michael Steffen, AMD . Ironwood: Delivering best in class perf, perf/TCO and perf/Watt for reasoning model training and serving, Norm Jouppi & Sridhar Lakshmanamurthy, Google 6:15PM-6:30PM Closing Remarks . Closing Remarks, Larry Yang, Vice Chair |
2025-08-26 | Hot Chips |
| https://hc2025.hotchips.org/ | ||||
| T11 | AI, SOC, DRAM |
Posters : 5개 > HyperAccel Adelia: A 4nm LLM Processor for Efficient Generative AI Inference Seungjae Moon; Hyper Accel > Basilisk: A 34 mm² End-to-End Open-Source 64-bit Linux-Capable RISC-V SoC in 130nm BiCMOS Philippe Sauter; ETH Zurich > Bit-Separable Transformer Accelerator Leveraging Output Activation Sparsity for Efficient DRAM Access Seunghyun Park; Kyungpook National University > Multi-modal Few-step Diffusion Model Accelerator with Mixed-Precision and Reordered Group-Quantization for On-device Generative AI Sangjin Kim; KAIST > An Energy-Efficient Spatial Computing SoC for Real-time Interactable-Rendering and Modeling with Surface-aware 3D Gaussian Splatting Seokchan Song; KAIST |
2025-08-24 | Hot Chips |
| https://hc2025.hotchips.org/ | ||||
| T12 | AI, NPU |
Posters : 6개 > BROCA: A Low-power and Low-latency Conversational Agent RISC-V System-on-Chip for Voice-interactive Mobile Devices Wooyoung Jo; KAIST > MEGA.mini: A NPU with Novel Heterogeneous AI Processing Architecture Balancing Efficiency, Performance, and Intelligence for the Era of Generative AI Donghyeon Han; Chung-Ang University > High Density Si-IPD Technologies as enabler for High-Performance and Low-Power consumption Processor Chips Mohamed Mehdi Jatlaoui; Murata > Clo-HDnn: Continual On-Device Learning Accelerator with Hyperdimensional Computing via Progressive Search Chang Eun Song; UC San Diego > A 4.69mW LLM Processor with Binary/Ternary Weights for Billion-Parameter Llama Model Sangyeob Kim; Yonsei University > KLIMA: Low-latency mixed-signal In-Memory Computing accelerator for solving arbitrary-order Boolean Satisfiability Tinish Bhattacharya; UC Santa Barbara |
2025-08-24 | Hot Chips |
| https://hc2025.hotchips.org/ | ||||