반도체 뉴스, HBM 기술 - Chiplet, 2.5D, Design, Test, Interposer, CPO

2025-09-24 : 뉴스 6건, 기술자료 16건 - 아래 링크 참고하시기 바랍니다.  다른 자료는 Search에서 키워드 입력하여 검색 가능합니다. 

	♥ 반도체 뉴스 (6건)
NO	키워드	제목	등록일	출처	링크 (URL)
N1	뉴스 모음	한국 반도체 산업협회 - 데일리 뉴스 모음	2025-09-17 6:00	KSIA	https://www.ksia.or.kr/infomationKSIA.php?data_tab=1
N2	뉴스 모음	2025년 9월 22일 반도체 기술 관련 주요 뉴스 요약 [제20250922-TT-01호]	2025-09-23 9:00	SPTA Times	https://www.sptatimeskorea.com/post/제20250922-tt-01호-2025년-9월-22일-반도체-기술-관련-주요-뉴스-요약
N3	뉴스 모음	2025년 9월 22일 반도체 장비 관련 주요 뉴스 요약 [제20250922-TE-01호]	2025-09-23 9:00	SPTA Times	https://www.sptatimeskorea.com/post/제20250922-te-01호-2025년-9월-22일-반도체-장비-관련-주요-뉴스-요약
N4	뉴스 모음	2025년 9월 22일 글로벌 반도체 산업 관련 주요 뉴스 요약 [제20250922-TI-01호]	2025-09-23 9:00	SPTA Times	https://www.sptatimeskorea.com/post/제20250922-ti-01호-2025년-9월-22일-글로벌-반도체-산업-관련-주요-뉴스-요약
N5	HBM, 삼성	삼성, HBM3e 엔비디아 테스트 통과, HBM4도 최종 단계	2025.09.22 19:07	QUASARZONE	https://quasarzone.com/bbs/qn_hardware/views/1900928
N6	HBM, 마이크론	마이크론 'HBM4' 이어 '소캠'도 밀린다, 삼성전자·SK하이닉스 메모리 양강 체제 가속	2025-09-22 14:53	Business Post	https://www.businesspost.co.kr/BP?command=article_view&num=412931
	♥ 반도체 기술 자료 (16건)
NO	키워드	제목	등록일	출처	링크 (URL)
T1	KGD	Screening For Known Good Interposers	2025-01-14	SemiEngineering	https://semiengineering.com/screening-for-known-good-interposers/
T2	2.5D, Design	Design and verification of silicon bridge in 2.5D advanced package based on universal chiplet interconnect express (UCIe)	2025년 5월	ScienceDirect	https://www.sciencedirect.com/science/article/abs/pii/S0026271425001234
T3	2.5D, Design	Optimization of embedded cooling in 2.5D integrated circuits through genetic algorithm-driven TSV layout design	2025년 9월	ScienceDirect	https://www.sciencedirect.com/science/article/abs/pii/S036054422502907X
T4	2.5D, Test	Optimization of Built-In Self-Test test chain configuration in 2.5D Integrated Circuits Using Constrained Multi-Objective Evolutionary Algorithm	2025년 3월	ScienceDirect	https://www.sciencedirect.com/science/article/abs/pii/S0952197624020359
T5	2.5D, Test	A constrained multi-objective coevolutionary algorithm with adaptive operator selection for efficient test scheduling in interposer-based 2.5D Ics	2025년 10월	ScienceDirect	https://www.sciencedirect.com/science/article/abs/pii/S2210650225002433
T6	2.5D, Thermal	Multi-chip Jet impingement cooling for heat dissipation in 2.5D integrated system with 1 kW+ thermal design power	2025년 7월	ScienceDirect	https://www.sciencedirect.com/science/article/abs/pii/S0017931025003199
T7	2.5D, Trends	Emerging Trends and Key Markets in 2.5D and 3D Semiconductor Packaging Technologies	2024-11-04	Semiconductor Digest	https://www.semiconductor-digest.com/emerging-trends-and-key-markets-in-2-5d-and-3d-semiconductor-packaging-technologies/
T8	Chiplet, Interposer	ChipletQuake: On-die Digital Impedance Sensing for Chiplet and Interposer Verification	2025-04-28	arXiv	https://arxiv.org/html/2504.19418v1
T9	2.5D, Interposer	Next-generation high-density RDL packaging for a 2.5D large silicon interposer : Page 10~15	2025년 1월	Chip Scale Review	https://chipscalereview.com/wp-content/uploads/2025/01/Chip-Scale-Review_January-February_2025-digital.pdf
T10	TSV	Through-silicon Via Advanced Packaging Technology and Its Radio Frequency Applications	2025년 6월	ScienceDirect	https://www.sciencedirect.com/science/article/pii/S2709472325000322
T11	CPO	Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review	2025-04-02	MDPI	https://www.mdpi.com/2072-666X/16/4/431
T12	CPO	Photonic Integrated Circuits: Research Advances and Challenges in Interconnection and Packaging Technologies -	2025-08-18	MDPI	https://www.mdpi.com/2304-6732/12/8/821
T13	CPO	Progress in Research on Co-Packaged Optics	2024-09-29	MDPI	https://www.mdpi.com/2072-666X/15/10/1211
T14	반도체 기술	Rambus Blog : 개인 정보 요구 없이 클릭하면 바로 열람 가능 . Topics: > AI & Machine Learning / Anti-Counterfeiting / Automotive / Controllers / Crypto Accelerator Cores / CXL / Data Center / DDR5 Client Chipsets / DDR5 Server Chipsets / DPA Countermeasures / Edge / GDDR / General / Government / HBM / Hybrid Memory / IoT / PCI Express / Primers / Protocol Engines / Provisioning & Key Management / Root of Trust	2025	Rambus	https://www.rambus.com/blog/
T15	반도체 기술	Rambus Resource Library : Informational videos, papers, presentations, and more - Register를 요구함 . Types : Briefs / Presentations / Primers / Reports / Videos / Webinars / White Papers  . Product Family : Anti-Counterfeiting / Controllers / Corporate / Crypto Accelerator Cores / CryptoManager / CryptoMedia / CXL Controllers / CXL / Memory Initiative / DDR / DDR4 Chipsets / DDR5 Chipsets / DPA Countermeasures / Forward Error Correction / GDDR / HBM / Inline Memory Encryption / LPDDR / MIPI / PCI Express / Provisioning & Key Management / Quantum Safe Cryptography / Root of Trust / Security / Protocol Engines / Software Protocols / Video Compression	2025	Rambus	https://www.rambus.com/resource-library/
T16	반도체 기술	Rambus Webinars : Register를 요구함 . Topics: > Anti-Counterfeiting / Controllers / Corporate / CryptoManager / DPA Countermeasures / Memory PHYs / Provisioning & Key Management / Quantum Safe Cryptography / Root of Trust / Security Protocol Engines / SerDes PHYs / Server DIMM Chipsets	2025	Rambus	https://www.rambus.com/webinars/